·热传导率可达1.2W/mKThermal Conductivity 1.2W/mK
·广泛应用于低压力情况下Designed for low-stress applications
·优异的自粘性能Excellent adhesive properties
·多种满足客户需要的产品，如DC1系列和玻纤增强系列Varied application products for customer which is DC1 series and with fiber-glass series
·尺寸可定制
适用场合
·半导体散热装置Semiconductors to heat sink
·通讯设备Telecommunications equipment
·显卡Graphics cards
·记忆存储模块Memory modules
·LED 照明设备LED solid state lighting
·电源设备Power electronics
·LCD和等离子电视LCD and PDP flat panel TV
适用场合
·半导体散热装置Semiconductors to heat sink ·通讯设备Telecommunications equipment ·显卡Graphics cards ·记忆存储模块Memory modules ·LED 照明设备LED solid state lighting ·电源设备Power electronics ·LCD和等离子电视LCD and PDP flat panel TV