·热传导率可达2.0 W/mK Thermal Conductivity 2.0 W/mK ·低压力下就有较低的热阻Ultra-thin 超薄型 u Low thermal resistance at low pressure ·优异的自粘性能Excellent adhesive properties ·阻燃94 V0 ·耐温 -50℃-200℃
适用场合
·半导体散热装置Semiconductors to heat sink ·通讯设备Telecommunications equipment ·显卡Graphics cards显卡 ·记忆存储模块Memory modules ·照明设备LED solid state lightingLED ·台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers ·电源设备Power electronics ·LCD和等离子电视LCD and PDP flat panel TV
适用场合
·半导体散热装置Semiconductors to heat sink ·通讯设备Telecommunications equipment ·显卡Graphics cards显卡 ·记忆存储模块Memory modules ·照明设备LED solid state lightingLED ·台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers ·电源设备Power electronics ·LCD和等离子电视LCD and PDP flat panel TV