·热传导率可达3.5 W/mKThermal Conductivity 3.5W/mK
·高柔顺性Soft and highly Compliant
·低压力下就有较低的热阻Low thermal resistance at low pressure
·优异的自粘性能，便于装配Naturally tacky for easy assembly
·阻燃94 V0
·耐温-50℃-200℃
适用场合
·半导体散热装置Semiconductors to heat sink
·通讯设备Telecommunications equipment
·显卡Graphics cards
·记忆存储模块Memory modules 记忆存储模块
·LED 照明设备 LED solid state lighting LED 照明设备
·电源设备Power electronics 电源设备
·LCD和等离子电视 LCLCD and PDP flat panel TV
适用场合
·半导体散热装置Semiconductors to heat sink ·通讯设备Telecommunications equipment ·显卡Graphics cards ·记忆存储模块Memory modules 记忆存储模块 ·LED 照明设备 LED solid state lighting LED 照明设备 ·电源设备Power electronics 电源设备 ·LCD和等离子电视 LCLCD and PDP flat panel TV